Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)

Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)

12 Aug
|
Sanmina-SCI Systems de México
|
Le Plateau-Mont-Royal

12 Aug

Sanmina-SCI Systems de México

Le Plateau-Mont-Royal

Lead process architecture and development for optical and microelectronic solutions, requiring expertise in flip-chip and wire bonding.

📌 Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)
🏢 Sanmina-SCI Systems de México
📍 Le Plateau-Mont-Royal

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