Senior Optoelectronic Packaging Process Architect - $145,000 - $165,000 A Year (Ottawa)

Senior Optoelectronic Packaging Process Architect - $145,000 - $165,000 A Year (Ottawa)

12 Aug
|
Sanmina
|
Ottawa

12 Aug

Sanmina

Ottawa

A leading technology firm in Ottawa is seeking an industry expert to lead the process architecture for next-generation optical and microelectronic solutions. This role involves defining assembly strategies, leading development for critical process recipes, and interfacing with customers. The ideal candidate has over 8 years of experience in microelectronics packaging and deep expertise in Flip Chip and Wire Bonding processes. This position offers a market-competitive salary ranging from $145,000 to $165,000 annually. #J-18808-Ljbffr

📌 Senior Optoelectronic Packaging Process Architect - $145,000 - $165,000 A Year (Ottawa)
🏢 Sanmina
📍 Ottawa

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