Microelectronic Packaging Design Engineer - End-to-End (Ottawa)

Microelectronic Packaging Design Engineer - End-to-End (Ottawa)

11 Aug
|
Global Talent Alliance, Canada
|
Ottawa

11 Aug

Global Talent Alliance, Canada

Ottawa

A leading engineering services provider in Ottawa is seeking a Microelectronic Packaging Design Engineer. This role involves defining technologies and designs for microelectronic modules, ensuring compliance, and generating product documentation. The ideal candidate has at least 5 years of experience in electronic hardware design, particularly in Wafer Level and Chip Scale Packaging. Proficiency in CAD software is essential. Robust communication skills and customer focus are highly valued.
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📌 Microelectronic Packaging Design Engineer - End-to-End (Ottawa)
🏢 Global Talent Alliance, Canada
📍 Ottawa

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