Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and cooperative design will be vital in this pivotal role.Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications. Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies.Key Responsibilities:Oversee design and development of IC packages and COB solutionsConduct 3D signal integrity modeling,



validating with TDR and S-parameter testingWrite technical reports for both internal and external stakeholdersCreate PCB layouts for performance and reliabilityMentor junior engineers in design methodologies and toolsRequirements:Bachelor's degree in Electrical Engineering or related fieldOver 8 years of experience in signal integrity or IC package designProficiency with EDA tools and measurement equipmentFamiliarity with various advanced packaging methodsAbility to manage technical relationships with suppliersYour expertise will help shape a new era in high-performance connectivity products at Semtech.#J-18808-Ljbffr

📌 Principal Engineer For Signal Integrity (Burlington)
🏢 Semtech
📍 Burlington