Transform the future of technology at AMD as an AI and Design Automation Engineer. Spearhead automation workflows to enhance design efficiency and scalability in semiconductor packaging. Join AMD in a pivotal engineering role that focuses on the development and deployment of AI-driven frameworks for complex design projects.
You'll collaborate across multidisciplinary teams, integrating AI/ML methodologies into package design for improved optimization and quality. Your contributions will play a vital role in empowering next-generation packaging technologies. Key Responsibilities:
- Develop and maintain automation frameworks for package substrates and interposer integration
- Implement AI/ML methods for design activities and optimization
- Collaborate with design teams to identify automation opportunities
- Partner with EDA tools teams to enhance design capabilities
- Document best practices and reusable workflows for team adoption
Requirements:
- Experience in semiconductor packaging or SOC design automation
- Solid knowledge of EDA tools like Cadence and Synopsys
- Proficiency in scripting languages, preferably Python
- Familiarity with AI frameworks like TensorFlow or PyTorch
- Bachelor’s or higher degree in a relevant engineering field
Drive innovation in advanced packaging through automation and AI at AMD.