Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Gatineau)

Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Gatineau)

06 Aug
|
Ciena
|
Gatineau

06 Aug

Ciena

Gatineau

Process Engineer needed to optimize assembly processes for Photonic Integrated Circuit products. Includes designing wire bonding recipes and reliability testing.

📌 Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Gatineau)
🏢 Ciena
📍 Gatineau

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