Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Ottawa)

Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Ottawa)

05 Aug
|
Ciena
|
Ottawa

05 Aug

Ciena

Ottawa

A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Market-competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.#J-18808-Ljbffr

📌 Photonic Process Engineer: Wire Bonding & Die Attach - $71,600 - $114,400 A Year (Ottawa)
🏢 Ciena
📍 Ottawa

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