Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and cooperative design will be vital in this pivotal role.
Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications. Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies.
Key Responsibilities:
• Oversee design and development of IC packages and COB solutions
• Conduct 3D signal integrity modeling, validating with TDR and S-parameter testing
• Write technical reports for both internal and external stakeholders




• Create PCB layouts for performance and reliability
• Mentor junior engineers in design methodologies and tools
Requirements:
• Bachelor's degree in Electrical Engineering or related field
• Over 8 years of experience in signal integrity or IC package design
• Proficiency with EDA tools and measurement equipment
• Familiarity with various advanced packaging methods
• Ability to manage technical relationships with suppliers
Your expertise will help shape a new era in high-performance connectivity products at Semtech.
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📌 Principal Engineer for Signal Integrity (Calgary)
🏢 Semtech
📍 Calgary