Transform the future of technology at AMD as an AI and Design Automation Engineer. Spearhead automation workflows to enhance design efficiency and scalability in semiconductor packaging.
Join AMD in a pivotal engineering role that focuses on the development and deployment of AI-driven frameworks for complex design projects. You'll collaborate across multidisciplinary teams, integrating AI/ML methodologies into package design for improved optimization and quality. Your contributions will play a vital role in empowering next-generation packaging technologies.
Key Responsibilities:
• Develop and maintain automation frameworks for package substrates and interposer integration
• Implement AI/ML methods for design activities and optimization
• Collaborate with design teams to identify automation opportunities
• Partner with EDA tools teams to enhance design capabilities
• Document best practices and reusable workflows for team adoption
Requirements:
• Experience in semiconductor packaging or SOC design automation
• Solid knowledge of EDA tools like Cadence and Synopsys
• Proficiency in scripting languages, preferably Python
• Familiarity with AI frameworks like TensorFlow or PyTorch
• Bachelor’s or higher degree in a relevant engineering field
Drive innovation in advanced packaging through automation and AI at AMD.
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