Join AMD as a Packaging Engineering leader, where your expertise will drive next-generation Data Center GPU and MI package designs. Collaborate in a culture that fosters innovation and results. As a key player, your role involves leading diverse teams to execute advanced packaging solutions that meet rigorous quality and performance benchmarks.

You will develop frameworks for risk management and work closely with design and manufacturing sectors to ensure successful program implementation. Key Responsibilities:
Direct execution of GPU/MI package design initiatives
Manage program lifecycles and quality targets
Lead cross-functional collaboration for design feasibility
Advocate for AI-driven methodologies and workflows
Mentor and cultivate a high-performing engineering team Requirements:
Extensive experience in high-performance semiconductor design
Results-oriented approach to managing complex projects
Solid grasp of multi-die integration and package layout
Familiarity with optimization tools for engineering workflows
Proven communication skills with stakeholders at all levels Your leadership will play a crucial role in AMD's commitment to cutting-edge design and engineering excellence.

📌 Packaging Engineering Leadership Role At Amd Markham
🏢 Advanced Micro Devices
📍 Markham