AMD in Markham, Ontario seeks a highly motivated engineer to advance the package design automation program. You will develop, deploy, and maintain AI-assisted workflows for substrate, interposer, and bridge-based integration, aiming to improve efficiency and design quality.
You will collaborate with Design, EDA, and AI/ML teams to translate complex challenges into scalable automation, apply AI/ML to routing, placement, and verification, and help accelerate next‑generation packaging innovation.
J-18808-Ljbffr