At AMD, we believe technology can change lives for the better. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them. We are seeking a highly motivated and seasoned engineer to support the package design organization in the development and deployment of AI-driven automation workflows.

This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design. The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented setting and plays a critical part in enabling next-generation packaging innovation.

Translate complex design challenges into scalable automation solutions Work effectively across Design, EDA, and AI/ML teams Operate with limited supervision, delivering high-quality results aligned to project goals Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration. Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification. Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.

Partner with EDA tools teams and vendors to implement automation features,



enhance tool capabilities and workflows, support next-generation advanced packaging design enablement Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams Support execution of design milestones and tape-outs, ensuring automation readiness and quality Experience in semiconductor packaging or SOC physical design automation Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++ Experience applying AI/ML techniques to engineering or design workflows. Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA) Academic Credentials ~ Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

📌 Senior ASIC Package Design Automation and AI Engineer (Markham)
🏢 AMD
📍 Markham