Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Boucherville)

Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Boucherville)

04 Aug
|
Ciena
|
Boucherville

04 Aug

Ciena

Boucherville

Process Engineer sought to optimize assembly processes for Photonic Integrated Circuit products, including designing wire bonding recipes and reliability testing.

📌 Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Boucherville)
🏢 Ciena
📍 Boucherville

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