Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)

Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)

04 Aug
|
Sanmina-SCI Systems de México
|
Boucherville

04 Aug

Sanmina-SCI Systems de México

Boucherville

Lead process architecture and development for optical and microelectronic solutions, requiring expertise in flip-chip and wire bonding.

📌 Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)
🏢 Sanmina-SCI Systems de México
📍 Boucherville

Reply to this offer

Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.

Subscribe to this job alert:

Get the latest job offers by email for: senior optical packaging & flip-chip process architect - $145,000 - $165,000 a year (boucherville) / boucherville

Subscribe to this job alert:

Get the latest job offers by email for: senior optical packaging & flip-chip process architect - $145,000 - $165,000 a year (boucherville) / boucherville