Staff Optical Sub Assembly Electrical Designer (Ahuntsic)

Staff Optical Sub Assembly Electrical Designer (Ahuntsic)

04 Aug
|
NOKIA
|
Ahuntsic

04 Aug

NOKIA

Ahuntsic

As an Optical Sub Assembly Electrical Designer at Nokia, you will be instrumental in the specification, design, and implementation of cutting‑edge digital and analog electrical hardware for our next‑generation optical sub‑assemblies. Your expertise in analog design and simulation will help create high‑density units that meet rigorous targets for low cost, high yield, and reliability, all while ensuring low power consumption. This role offers a unique opportunity to contribute to innovative technologies, pushing the limits of what’s possible and developing designs that will shape the future of telecommunications.

Join us in pioneering the next wave of advancements!

How You Will Contribute And What You Will Learn

Lead the design and development of innovative electrical circuits for cutting‑edge optical modules and test platforms.

Collaborate with Product Architects to convert product requirements into precise hardware specifications.

Manage the end‑to‑end electrical design process from initial block diagrams to detailed schematics.

Work in tandem with mechanical and software teams to ensure seamless integration of all designs.

Coordinate with PCB layout experts to optimize electrical designs for effective production.





Facilitate weekly program status updates and contribute actively to release management meetings.

Engage with Supply Chain representatives to oversee material acquisition and prototype assembly.

Mentor junior hardware team members, providing technical guidance to enhance their skills and the overall team’s capabilities.

Key Skills And Experience Must-Have

Minimum B.Sc or B.Eng in Electrical Engineering or Computer Engineering

At least 10 years of hardware design experience with a strong grasp of the hardware product design lifecycle

Proficiency in schematic capture, symbol creation, and circuit layout software

In‑depth knowledge of PCB design processes, including multilayer and complex packaging

Strong verbal and written communication skills

Nice-To-Have

Experience with HDI (High Density Interconnect) and MSAP

Understanding of optical communications and transceiver designs

Experience using digital test equipment like oscilloscopes and spectrum analyzers

Familiarity with advanced modulation‑format telecommunication systems

Experience leading projects and mentoring junior team members

📌 Staff Optical Sub Assembly Electrical Designer (Ahuntsic)
🏢 NOKIA
📍 Ahuntsic

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