Join AMD as a Packaging Engineering leader, where your expertise will drive next-generation Data Center GPU and MI package designs. Collaborate in a culture that fosters innovation and results. As a key player, your role involves leading diverse teams to execute advanced packaging solutions that meet rigorous quality and performance benchmarks.

You will develop frameworks for risk management and work closely with design and manufacturing sectors to ensure successful program implementation. Key Responsibilities:

- Direct execution of GPU/MI package design initiatives
- Manage program lifecycles and quality targets
- Lead cross-functional collaboration for design feasibility
- Advocate for AI-driven methodologies and workflows
- Mentor and cultivate a high-performing engineering team Requirements:
- Extensive experience in high-performance semiconductor design
- Results-oriented approach to managing complex projects
- Solid grasp of multi-die integration and package layout
- Familiarity with optimization tools for engineering workflows
- Proven communication skills with stakeholders at all levels Your leadership will play a crucial role in AMD's commitment to cutting-edge design and engineering excellence.

📌 Packaging Engineering Leadership Role at AMD (Markham)
🏢 Advanced Micro Devices
📍 Markham