Join Sheba Microsystems, based in Toronto, as an Expert MEMS Packaging Engineer, focusing on innovative camera solutions. This permanent role includes hands-on packaging development and process optimization.

As a key member of the engineering team, you will develop and evaluate MEMS packages while optimizing fabrication processes such as adhesive dispensing and wire bonding. Your analytical skills will play a pivotal role in troubleshooting and improving assembly reliability through effective root cause analysis. Engage in product planning and help shape technical milestones as part of a collaborative work environment.

Key Responsibilities:



• Assemble and evaluate MEMS packages per established specifications • Optimize processes for die attach and wire bonding techniques • Conduct structured root cause analysis for packaging failures • Perform testing and calibration of MEMS devices and modules • Lead improvements in production processes with creative solutions

Requirements: • Bachelor’s degree in Mechanical or Electrical Engineering • 2+ years of relevant MEMS packaging experience • Proficiency in MEMS assembly processes and methodologies • Familiarity with 3D CAD tools like Fusion 360 • Fluency in English for effective technical communication

Bring your expertise in MEMS technology and driving innovation to Sheba Microsystems. #J-18808-Ljbffr

📌 Expert MEMS Packaging Engineer in Toronto
🏢 Sheba Microsystems
📍 Toronto