Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and cooperative design will be vital in this pivotal role. Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications.

Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies. Key Responsibilities:
Oversee design and development of IC packages and COB solutions
Conduct 3D signal integrity modeling, validating with TDR and S-parameter testing
Write technical reports for both internal and external stakeholders




Create PCB layouts for performance and reliability
Mentor junior engineers in design methodologies and tools

Requirements:
Bachelor's degree in Electrical Engineering or related field
Over 8 years of experience in signal integrity or IC package design
Proficiency with EDA tools and measurement equipment
Familiarity with various advanced packaging methods
Ability to manage technical relationships with suppliers

Your expertise will help shape a current era in high-performance connectivity products at Semtech.

📌 Principal Engineer For Signal Integrity Burlington
🏢 Semtech
📍 Burlington