Join the cutting-edge world of photonics as a PIC Packaging Engineer. Focus on developing innovative packaging solutions and integration techniques for next-gen optical devices.

This role as a PIC Packaging Engineer involves creating packaging architectures that enhance performance in photonic integrated circuits and optoelectronic devices. You will engage with multidisciplinary teams in the pursuit of manufacturable and high-performing systems. Tackling complex challenges will be key as you support the transition from prototype to high-volume manufacturing.

Key Responsibilities:
• Design packaging solutions that maximize optical performance
• Conduct optical alignment and fibre attachment
• Collaborate on successful device manufacturability




• Investigate packaging challenges and optimize processes
• Assist in scaling product development with partners

Requirements:
• Bachelor’s or higher in related engineering fields
• Proven experience in photonic or semiconductor packaging
• Solid understanding of optical and precision assembly
• Knowledge of thermal and mechanical reliability aspects
• Creative problem-solving skills in engineering

Leverage your skills in photonic systems to contribute to advanced optical technologies.
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📌 PIC Packaging Engineer for Optical Systems (British Columbia)
🏢 Darwin Recruitment
📍 British Columbia