Join Sheba Microsystems, based in Toronto, as an Expert MEMS Packaging Engineer, focusing on creative camera solutions. This permanent role includes hands-on packaging development and process optimization.

As a key member of the engineering team, you will develop and evaluate MEMS packages while optimizing fabrication processes such as adhesive dispensing and wire bonding. Your analytical skills will play a pivotal role in troubleshooting and improving assembly reliability through effective root cause analysis. Engage in product planning and help shape technical milestones as part of a collaborative work environment.

Key Responsibilities:
• Assemble and evaluate MEMS packages per established specifications
• Optimize processes for die attach and wire bonding techniques




• Conduct structured root cause analysis for packaging failures
• Perform testing and calibration of MEMS devices and modules
• Lead improvements in production processes with innovative solutions

Requirements:
• Bachelor’s degree in Mechanical or Electrical Engineering
• 2+ years of relevant MEMS packaging experience
• Proficiency in MEMS assembly processes and methodologies
• Familiarity with 3D CAD tools like Fusion 360
• Fluency in English for effective technical communication

Bring your expertise in MEMS technology and driving innovation to Sheba Microsystems.
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📌 Expert MEMS Packaging Engineer in Toronto (Ontario)
🏢 Sheba Microsystems
📍 Ontario