Overview
At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. We ground our work in a culture of innovation and collaboration, believing real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary.The Role
The 3D‑IC Design and SoC Construction CAD team delivers automated environments for industry‑leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high‑performance bus implementation, and timing budgeting. We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework, increasingly embedding AI‑driven capabilities at every stage of the stack, from silicon to system.This role is part of a global team working in concert with design teams across North America, China, and India. You will collaborate directly with the global CAD organization and project teams to understand design requirements and deliver innovative solutions that combine EDA tools, custom in‑house capabilities, and end‑to‑end AI integration.Key Responsibilities
Implement and maintain 3D‑IC and advanced packaging design flows from RTL through signoff.Develop and integrate end‑to‑end AI capabilities into CAD flows—including ML‑based optimization, predictive modeling, and LLM‑assisted automation.Build and deploy agentic AI systems that automate multi‑step design and verification tasks.Partner with EDA vendors (Synopsys, Cadence) on 3D‑IC feature requirements, best practices, and AI co‑development opportunities.Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.Regress methodology,



analyze results, and develop capabilities that measurably improve quality of results.Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: timing, area, and performance.Preferred Experience
Strong experience in 3D‑IC design and advanced packaging technologies.Hands‑on experience with Synopsys 3DIC Compiler and related EDA toolchains.Robust understanding of EDA tools from Synopsys and Cadence.Demonstrated experience applying AI to CAD, EDA, or hardware design problems.Experience building or working with LLM‑based tools, agentic AI frameworks, or AI‑assisted automation pipelines.Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment.Experience with Verilog, RTL, and UPF for multi‑clock domain and low‑power designs.Familiarity with distributed and cloud compute environments for flow automation.Excellent verbal and written communication skills.Academic Credentials
Bachelor's or Master's degree in Computer Engineering, Electrical Engineering, or related field.Location
Markham, ON, CanadaBenefits
Benefits are described on the AMD website.Equal Opportunity Statement
AMD and its subsidiaries are equal‑opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. Applications are accommodated under relevant laws throughout all stages of recruitment and selection.AI Recruiting Notice
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
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📌 3d Ic And Advanced Packaging Cad Engineer (Winnipeg)
🏢 AMD
📍 Winnipeg