Join Semtech as a Principal Engineer focusing on cutting-edge IC Package Design and Signal Integrity. Leverage your high-speed design skills to enhance Datacenter connectivity in this agile team. In the SIP Business Unit, you will lead high-impact projects in IC package layout and signal integrity modeling.
Collaborate closely with global suppliers and internal teams to ensure the highest quality and reliability standards. This position offers a unique prospect to shape the future of data center connectivity technology. Key Responsibilities:
Lead design efforts for high-speed IC packages and COB solutions
Execute 3D signal integrity modeling and testing
Document findings through comprehensive technical reports
Develop PCB layout designs for successful evaluations
Facilitate supplier interactions and package design phases Requirements:
Bachelor's degree in relevant engineering fields
8+ years of experience in IC Package or Signal Integrity roles
Expertise in EDA tools and RF/SI measurement techniques
Familiarity with advanced packaging technologies
Excellent communication and documentation skills Bring your experience to the forefront of cutting-edge semiconductor packaging and drive meaningful impact.