Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and collaborative design will be vital in this pivotal role.

Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications. Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies.

Key Responsibilities: • Oversee design and development of IC packages and COB solutions • Conduct 3D signal integrity modeling,



validating with TDR and S-parameter testing • Write technical reports for both internal and external stakeholders • Create PCB layouts for performance and reliability • Mentor junior engineers in design methodologies and tools

Requirements: • Bachelor's degree in Electrical Engineering or related field • Over 8 years of experience in signal integrity or IC package design • Proficiency with EDA tools and measurement equipment • Familiarity with various advanced packaging methods • Ability to manage technical relationships with suppliers

Your expertise will help shape a current era in high-performance connectivity products at Semtech. #J-18808-Ljbffr

📌 Principal Engineer for Signal Integrity (Burlington)
🏢 Semtech
📍 Burlington