Lead the future of semiconductor technology as the Director of System in Package Architecture at SK hynix in San Jose, CA. Specialize in High Bandwidth Memory and advanced packaging. This onsite leadership role requires an individual to spearhead the development of innovative packaging system architectures.

You will oversee design aspects and enhance SiP performance while driving key research initiatives. Leading strategic partnerships will be crucial to ensure timely technology development and successful market launches. Key Responsibilities:

- Direct the development of cutting-edge packaging architectures
- Oversee mechanical and electrical test vehicle creation
- Drive research advancements in SiP methodologies
- Foster collaborations for streamlined technology development Requirements:
- BS degree in Electrical Engineering or similar
- Minimum of 7 years in advanced packaging architecture
- Proven success in engineering team leadership
- Experience in aligning cross-functional teams
- Strong communication skills with technical strategies Bring your vision and leadership skills to SK hynix, and redefine the future of memory technology.

📌 Director of System in Package Engineering (Canada)
🏢 SK hynix America
📍 Canada