Join Semtech as a Principal Engineer focusing on cutting-edge IC Package Design and Signal Integrity. Leverage your high-speed design skills to enhance Datacenter connectivity in this dynamic team.
In the SIP Business Unit, you will lead high-impact projects in IC package layout and signal integrity modeling. Collaborate closely with global suppliers and internal teams to ensure the highest quality and reliability standards. This position offers a unique opportunity to shape the future of data center connectivity technology.
Key Responsibilities:
- Lead design efforts for high-speed IC packages and COB solutions
- Execute 3D signal integrity modeling and testing
- Document findings through comprehensive technical reports
- Develop PCB layout designs for successful evaluations
- Facilitate supplier interactions and package design phases
Requirements:
- Bachelor's degree in relevant engineering fields
- 8+ years of experience in IC Package or Signal Integrity roles
- Expertise in EDA tools and RF/SI measurement techniques
- Familiarity with advanced packaging technologies
- Excellent communication and documentation skills
Bring your experience to the forefront of cutting-edge semiconductor packaging and drive meaningful impact.